US 12,431,359 B2
Semiconductor package electrical contacts and related methods
Yusheng Lin, Phoenix, AZ (US); Michael J. Seddon, Gilbert, AZ (US); Francis J. Carney, Mesa, AZ (US); Takashi Noma, Ota (JP); and Eiji Kurose, Oizumi-machi (JP)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on May 10, 2022, as Appl. No. 17/662,786.
Application 17/662,786 is a division of application No. 16/861,910, filed on Apr. 29, 2020, granted, now 11,367,619.
Application 16/702,958 is a division of application No. 15/679,661, filed on Aug. 17, 2017, granted, now 10,529,576, issued on Aug. 18, 2020.
Application 16/861,910 is a continuation in part of application No. 16/702,958, filed on Dec. 4, 2019, granted, now 11,328,930, issued on May 10, 2022.
Application 16/861,910 is a continuation in part of application No. 15/921,898, filed on Mar. 15, 2018, granted, now 10,748,850, issued on Aug. 18, 2020.
Prior Publication US 2022/0270884 A1, Aug. 25, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 21/302 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/12 (2006.01); H01L 23/31 (2006.01)
CPC H01L 21/302 (2013.01) [H01L 21/48 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/12 (2013.01); H01L 23/3185 (2013.01); H01L 24/04 (2013.01); H01L 24/26 (2013.01); H01L 2224/94 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a semiconductor die comprising a first side and a second side, the first side of the semiconductor die coupled to one or more electrical contacts;
an organic material covering at least the first side of the semiconductor die, wherein the one or more electrical contacts extend through one or more openings in the organic material;
a metal-containing layer comprised in the one or more electrical contacts; and
one or more slugs directly coupled to an outer surface of the metal-containing layer;
wherein the outer surface of the metal-containing layer is coplanar with an outermost surface of the organic material.