US 12,431,339 B2
Adjustable de-chucking voltage
Andrew Nguyen, San Jose, CA (US); Lu Liu, San Jose, CA (US); Toan Q. Tran, San Jose, CA (US); and Daniel Nguyen, Santa Clara, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Apr. 27, 2023, as Appl. No. 18/307,931.
Prior Publication US 2024/0363315 A1, Oct. 31, 2024
Int. Cl. H01J 37/32 (2006.01); H01L 21/683 (2006.01)
CPC H01J 37/32697 (2013.01) [H01J 37/32724 (2013.01); H01L 21/6833 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/20235 (2013.01); H01J 2237/24564 (2013.01); H01J 2237/24585 (2013.01); H01J 2237/3321 (2013.01); H01J 2237/3327 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of de-chucking a substrate disposed in a process chamber, comprising:
processing a substrate in a chamber body, the substrate being coupled to a substrate support comprising a chucking electrode;
monitoring a property associated with a lift pin assembly movable relative to the chucking electrode via an actuator;
adjusting a first voltage level applied to the chucking electrode in response to the property associated with the lift pin assembly satisfying one or more criteria; and
monitoring a second voltage level associated with a heater element of the substrate support, wherein adjusting the first voltage level comprises adjusting the first voltage level based at least in part on the second voltage level.