US 12,431,327 B2
Stroboscopic electron-beam signal image mapping
Xianghong Tong, Hillsboro, OR (US); Martin Von Haartman, Portland, OR (US); Wen-Hsien Chuang, Portland, OR (US); Zhiyong Ma, Hillsboro, OR (US); Hyuk Ju Ryu, Hillsboro, OR (US); Prasoon Joshi, Hillsboro, OR (US); May Ling Oh, Portland, OR (US); Jennifer Huening, Hillsboro, OR (US); Shuai Zhao, Beaverton, OR (US); Charles Peterson, Hillsboro, OR (US); Ira Jewell, Hillsboro, OR (US); and Hasan Faraby, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Apr. 1, 2022, as Appl. No. 17/711,785.
Prior Publication US 2023/0317408 A1, Oct. 5, 2023
Int. Cl. H01J 37/26 (2006.01); H01J 37/244 (2006.01); H01J 37/28 (2006.01)
CPC H01J 37/265 (2013.01) [H01J 37/244 (2013.01); H01J 37/28 (2013.01); H01J 2237/221 (2013.01); H01J 2237/2443 (2013.01); H01J 2237/2801 (2013.01); H01J 2237/2814 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A method, comprising:
providing a modulated electrical test signal to an integrated circuit structure of a die, wherein the modulated electrical test signal has a first frequency;
applying a pulsed beam to the integrated circuit structure, wherein the pulsed beam comprises one of a frequency delta relative to the first frequency or a number of packets of beam pulses at the first frequency within each packet; and
detecting an imaging signal from the integrated circuit structure at a detector, wherein the frequency delta or the packets of beam pulses establishes a modulation of the imaging signal at a second frequency less than the first frequency and distinguishable by the detector.