| CPC H01G 4/232 (2013.01) [H01G 2/06 (2013.01); H01G 4/224 (2013.01); H01G 4/30 (2013.01)] | 15 Claims |
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1. A multilayer ceramic electronic component comprising:
a ceramic body that includes a plurality of internal electrodes stacked in a direction of a first axis with ceramic layers interposed therebetween, and has a rectangular parallelepiped shape having first and second end surfaces perpendicular to a second axis orthogonal to the direction of the first axis, and four connection surfaces each connecting the first and second end surfaces and extending along a direction of the second axis, the plurality of internal electrodes being alternately led out to the first and second end surfaces; and
first and second external electrodes disposed on the first and second end surfaces, respectively, and opposed to each other in the direction of the second axis,
wherein at least one connection surface of the connection surfaces has an uneven region located between the first and second external electrodes,
wherein the uneven region includes:
a plurality of recess portions that are formed along an extension direction intersecting the second axis, recessed in a depth direction orthogonal to the second axis and the extension direction, and arranged along an arrangement direction orthogonal to the depth direction and the extension direction, and
a protrusion portion disposed between the plurality of recess portions,
wherein a depth of each of the recess portions in the depth direction is 0.1 μm or greater and less than 2.5 μm, and
wherein an arrangement pitch of the recess portions along the arrangement direction is 1 μm or greater and 80 μm or less,
wherein a ratio of the arrangement pitch of the recess portions to the depth of each of the recess portions is 0.41 or greater and 700 or less.
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