US 12,431,259 B2
Conductive particle, conductive materials and connection structure
Yeong Jin Lim, Cheonan-si (KR); Kyung Heum Kim, Cheonan-si (KR); Chang Wan Bae, Cheonan-si (KR); Hyeon Yun Jeong, Cheonan-si (KR); Seok Won Jeong, Cheonan-si (KR); Hyun Sang Cho, Cheonan-si (KR); and Kyung Soo Kim, Cheonan-si (KR)
Assigned to Duksan Neolux Co., Ltd, Cheonan-si (KR)
Filed by Duksan Neolux Co., Ltd, Cheonan-si (KR)
Filed on Jul. 19, 2024, as Appl. No. 18/777,588.
Claims priority of application No. 10-2023-0094716 (KR), filed on Jul. 20, 2023.
Prior Publication US 2025/0029747 A1, Jan. 23, 2025
Int. Cl. H01B 1/22 (2006.01); B22F 1/18 (2022.01); C08J 3/12 (2006.01)
CPC H01B 1/22 (2013.01) [B22F 1/18 (2022.01); C08J 3/126 (2013.01); C08J 2325/14 (2013.01); C08J 2339/06 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A conductive particle to be dispersed in a resin composition of an anisotropic connection material comprising a binder resin and a solvent, the conductive particle comprising:
a core;
a metal-containing conductive layer provided on the core;
insulating fine particles provided in a first region on the conductive layer, the insulating fine particles comprising a first substituent having ability to bind to a metal in the conductive layer so that the insulating fine particles are attached to a surface of the conductive layer via the first substituent; and
a hydrophobic surface treatment layer provided in a second region on the conductive layer, the hydrophobic surface treatment layer comprising a second substituent having ability to bind to the metal in the conductive layer so that the hydrophobic surface treatment layer is attached to the surface of the conductive layer via the second substituent,
wherein the first and second regions do not overlap each other.