US 12,431,177 B2
Memory device, memory module, and operating method of memory device for processing in memory
Shinhaeng Kang, Suwon-si (KR); and Kyomin Sohn, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Nov. 29, 2022, as Appl. No. 18/070,741.
Claims priority of application No. 10-2022-0004964 (KR), filed on Jan. 13, 2022; and application No. 10-2022-0066650 (KR), filed on May 31, 2022.
Prior Publication US 2023/0223065 A1, Jul. 13, 2023
Int. Cl. G11C 11/22 (2006.01)
CPC G11C 11/2257 (2013.01) [G11C 11/2275 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A memory device, comprising:
a plurality of memory banks, each of the plurality of memory banks including:
a memory cell array including a plurality of memory cells connected with a plurality of word lines;
a row decoder connected with the memory cell array through the plurality of word lines;
a sense amplifier and write driver connected with the memory cell array through a plurality of bit lines;
a column decoder connected with the sense amplifier and write driver; and
control logic configured to receive a plurality of column address bits and a plurality of read commands,
wherein the control logic includes a processing-in-memory (PIM) address generator,
wherein, in a first operation mode, the control logic sends the plurality of column address bits to a memory bank of the plurality of memory banks, and
wherein, in a second operation mode, when the PIM address generator receives a first read command of the plurality of read commands, the control logic sends, to the memory bank, a first PIM address generated based on remaining column address bits other than some column address bits of the plurality of column address bits.