US 12,429,932 B2
Lid carveouts for processor lighting
Jerry Anton Ahrens, Sister Bay, WI (US); William Robert Alverson, Del Valle, TX (US); Amitabh Mehra, Fort Collins, CO (US); Grant Evan Ley, Eden, UT (US); Anil Harwani, Austin, TX (US); and Joshua Taylor Knight, Georgetown, TX (US)
Assigned to Advanced Micro Devices, Inc., Santa Clara, CA (US)
Filed by Advanced Micro Devices, Inc., Santa Clara, CA (US)
Filed on Mar. 25, 2022, as Appl. No. 17/704,862.
Prior Publication US 2023/0324967 A1, Oct. 12, 2023
Int. Cl. G06F 1/20 (2006.01)
CPC G06F 1/206 (2013.01) 20 Claims
OG exemplary drawing
 
1. A processing device comprising:
a substrate including at least one processor core and one or more lights connected via an electrical connection to the at least one processor core; and
an integrated heat spreader that is bonded to the substrate and covers the at least one processor core, the integrated heat spreader including a plurality of carveouts that expose at least one of the one or more lights, each of the plurality of carveouts being disposed along an edge of the integrated heat spreader and receding from an outer perimeter of the integrated heat spreader.