US 12,429,738 B2
Display panel
Xiaohong Jing, Guangdong (CN)
Assigned to Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Shenzhen (CN)
Appl. No. 17/417,861
Filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Guangdong (CN)
PCT Filed May 26, 2021, PCT No. PCT/CN2021/095926
§ 371(c)(1), (2) Date Nov. 17, 2022,
PCT Pub. No. WO2022/236873, PCT Pub. Date Nov. 17, 2022.
Claims priority of application No. 202110508364.0 (CN), filed on May 11, 2021.
Prior Publication US 2024/0016036 A1, Jan. 11, 2024
Int. Cl. G02F 1/1345 (2006.01); G02F 1/1333 (2006.01); G02F 1/1335 (2006.01); H10K 59/131 (2023.01); H10K 59/80 (2023.01); H10K 77/10 (2023.01)
CPC G02F 1/13452 (2013.01) [G02F 1/133305 (2013.01); G02F 1/133514 (2013.01); G02F 1/1345 (2013.01); G02F 1/13458 (2013.01); H10K 59/131 (2023.02); H10K 59/8722 (2023.02); H10K 77/111 (2023.02)] 11 Claims
OG exemplary drawing
 
1. A display panel, comprising a display region and a non-display region disposed on a side of the display region, wherein the display panel comprises:
a first substrate, wherein the first substrate comprises a first bonding portion, and the first bonding portion corresponds to the non-display region;
a second substrate, wherein the second substrate and the first substrate are disposed opposite to each other, the second substrate is located on a light exiting side of the display panel, the second substrate comprises a second bonding portion, the second bonding portion covers the first bonding portion, and an end of the second bonding portion is bonded and connected to the first bonding portion; and
a flexible circuit substrate, wherein the flexible circuit substrate is bonded and connected to another end of the second bonding portion, and the flexible circuit substrate is a chip on film or a flexible circuit board;
wherein the first bonding portion comprises a first underlay and a plurality of first conductive pads, and the first conductive pads are disposed on the first underlay; and
wherein the second bonding portion comprises a second underlay and a second conductive pad, the second conductive pad is disposed on a side of the second underlay facing the first substrate, the second conductive pad and the first conductive pads are disposed opposite to each other, and the second conductive pad is bonded and connected to the first conductive pads;
wherein the second bonding portion comprises a third conductive pad, the third conductive pad is disposed on the second underlay, and the second conductive pad is electrically connected to the third conductive pad;
the flexible circuit substrate comprises a first portion including a fourth conductive pad, the fourth conductive pad is bonded and connected to the third conductive pad, and a portion of the flexible circuit substrate away from the fourth conductive pad is disposed on a side of the first substrate away from the second substrate;
wherein the third conductive pad is perpendicular to the second conductive pad and is disposed on a side surface of the second underlay being an outward facing side surface and perpendicular to the side of the second underlay.