CPC H05K 9/0088 (2013.01) [H05K 9/006 (2013.01)] | 17 Claims |
1. A communication module product, comprising module elements provided on a substrate, wherein a periphery of the module elements where EMI shielding is to be performed is filled with EMI shielding material, to form a segmental shielding between the module elements, wherein the EMI shielding material comprises a resin material and metal particles, wherein the resin material and the metal particles are mixed with each other, and an insulating protective layer is disposed on a surface of each of the metal particles, and
wherein a material of the metal particles is a gradient composite consisting of silver, gold, copper, chromium, nickel, and nickel-iron, an alloy thereof,
wherein a size of the metal particles is between 0.1 μm and 30 μm, and
wherein the shielding material further comprises a curing agent, wherein the curing agent account for 0.1% to 0.2% of a weight of the shielding material.
|