US 11,770,920 B2
EMI shielding material, EMI shielding process, and communication module product
Linping Li, Huzhou (CN); Jinghao Sheng, Hangzhou (CN); and Zhou Jiang, Huzhou (CN)
Assigned to HUZHOU JIANWENLU TECHNOLOGY CO., LTD., Huzhou (CN)
Appl. No. 17/771,014
Filed by HUZHOU JIANWENLU TECHNOLOGY CO., LTD., Huzhou (CN)
PCT Filed Sep. 11, 2020, PCT No. PCT/CN2020/114836
§ 371(c)(1), (2) Date Apr. 22, 2022,
PCT Pub. No. WO2021/077937, PCT Pub. Date Apr. 29, 2021.
Claims priority of application No. 201911014276.4 (CN), filed on Oct. 23, 2019.
Prior Publication US 2022/0418174 A1, Dec. 29, 2022
Int. Cl. H05K 9/00 (2006.01)
CPC H05K 9/0088 (2013.01) [H05K 9/006 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A communication module product, comprising module elements provided on a substrate, wherein a periphery of the module elements where EMI shielding is to be performed is filled with EMI shielding material, to form a segmental shielding between the module elements, wherein the EMI shielding material comprises a resin material and metal particles, wherein the resin material and the metal particles are mixed with each other, and an insulating protective layer is disposed on a surface of each of the metal particles, and
wherein a material of the metal particles is a gradient composite consisting of silver, gold, copper, chromium, nickel, and nickel-iron, an alloy thereof,
wherein a size of the metal particles is between 0.1 μm and 30 μm, and
wherein the shielding material further comprises a curing agent, wherein the curing agent account for 0.1% to 0.2% of a weight of the shielding material.