US 11,770,902 B2
Circuit board, preparation method thereof, and electronic device
Yunfeng Jiao, Wuxi (CN); Lei You, Wuxi (CN); Zhicheng Yang, Wuxi (CN); Lihua Zhang, Wuxi (CN); and Hua Miao, Wuxi (CN)
Assigned to WUXI SHENNAN CIRCUITS CO., LTD., Wuxi (CN)
Filed by WUXI SHENNAN CIRCUITS CO., LTD., Wuxi (CN)
Filed on Oct. 12, 2021, as Appl. No. 17/498,767.
Application 17/498,767 is a continuation of application No. PCT/CN2021/084601, filed on Mar. 31, 2021.
Claims priority of application No. 202110114037.7 (CN), filed on Jan. 27, 2021.
Prior Publication US 2022/0240391 A1, Jul. 28, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 3/32 (2006.01); H05K 1/05 (2006.01)
CPC H05K 3/32 (2013.01) [H05K 1/0296 (2013.01); H05K 1/05 (2013.01); H05K 2201/03 (2013.01); H05K 2201/095 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A circuit board, comprising:
a substrate, defining a first through-hole;
a metal block, embedded in the first through-hole and fixedly connected to the substrate;
a conductive line layer, arranged on at least one side surface of the substrate; wherein the conductive line layer partially covers an opening of the first through-hole on a corresponding side surface of the substrate; and
a conductive channel, penetrating the conductive line layer and extending to the metal block;
wherein the conductive line layer defines at least one third through-hole corresponding to the conductive channel; the conductive channel comprises a second through-hole and a conductive medium plated on a wall of the second through-hole; and an end of the conductive medium is connected to the conductive line layer, and another end of the conductive medium is connected to the metal block.