CPC H01L 29/41758 (2013.01) [H01L 29/66462 (2013.01); H01L 29/778 (2013.01); H01L 29/2003 (2013.01)] | 20 Claims |
1. A semiconductor device, comprising:
a plurality of source fingers in a first plane;
a source pad in a second plane and connected to the plurality of source fingers;
a plurality of drain fingers in the first plane and interdigitated with the plurality of source fingers;
a drain pad in the second plane and connected to the plurality of drain fingers;
a gate pad connected to a gate and to a gate feed that extends at least partially around the source pad and the drain pad; and
an extended source finger contact in the second plane and connected to the source pad and to a source finger of the plurality of source fingers, and extending in parallel with the source finger and at least partially around the drain pad.
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