CPC H01L 23/5227 (2013.01) [H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/20 (2013.01); H01L 2224/03011 (2013.01)] | 20 Claims |
1. A package having a first region and a second region surrounded by the first region, comprising:
a first die, extending from the first region to the second region;
a second die bonded to the first die, wherein the second die is located within a span of the first die;
an encapsulant aside the second die, wherein at least a portion of the encapsulant is located in the second region; and
an inductor located in the second region and laterally having an offset from the second die, wherein a metal density in the first region is greater than a metal density in the second region.
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