CPC G06T 7/0008 (2013.01) [H01L 23/49503 (2013.01); H01L 23/49555 (2013.01); H01L 23/49568 (2013.01); H01L 24/00 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H05K 3/3421 (2013.01); H05K 2201/10689 (2013.01); H05K 2201/10969 (2013.01)] | 21 Claims |
1. An integrated circuit (“IC”) assembly, comprising:
an exposed pad IC package having:
a thermal pad having a top surface and a bottom surface and having at least one peripheral surface portion extending transversely of and continuous with the bottom surface; and
a layer of mold compound through which the bottom surface and the at least one peripheral surface portion are exposed, wherein:
the at least one peripheral surface portion is flushed with a surface of the layer of mold compound; and
the at least one peripheral surface portion corresponds to a surface of a flange that extends transversely of the top surface of the thermal pad.
|