US 11,768,016 B2
Thermal management device and system
Reza Monazami, Boston, MA (US); Sahar Jahani, Boston, MA (US); and Nicholas Keith Anselmo, Yorktown, VA (US)
Assigned to BLUEXTHERMAL, INC., Cambridge, MA (US)
Filed by BLUEXTHERMAL, INC., Cambridge, MA (US)
Filed on Jul. 22, 2020, as Appl. No. 16/936,358.
Claims priority of provisional application 62/877,122, filed on Jul. 22, 2019.
Claims priority of provisional application 62/954,759, filed on Dec. 30, 2019.
Prior Publication US 2021/0123641 A1, Apr. 29, 2021
Int. Cl. F25B 21/02 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01); A61F 7/00 (2006.01); H01L 23/38 (2006.01); A61B 18/20 (2006.01); H10N 10/00 (2023.01); H10N 10/13 (2023.01); H10N 10/17 (2023.01); A61B 18/00 (2006.01)
CPC F25B 21/02 (2013.01) [A61B 18/203 (2013.01); A61F 7/007 (2013.01); F28D 15/0233 (2013.01); F28D 15/0275 (2013.01); F28D 15/046 (2013.01); H01L 23/38 (2013.01); H10N 10/00 (2023.02); H10N 10/13 (2023.02); H10N 10/17 (2023.02); A61B 2018/00452 (2013.01); A61F 2007/0075 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A thermal management system, comprising:
a thermoelectric component having a first side configured to be thermally coupled to a target material and a second side opposite the first side;
a two-phase heat transfer unit thermally coupled to the second side of the thermoelectric component, the two-phase heat transfer unit having 1) a phase-transition chamber having an inlet region and an outlet region, 2) microfeatures in the phase-transition chamber spaced apart from each other such the microfeatures induce capillary forces to a working fluid that drives the working fluid from the inlet region of the phase-transition chamber to the outlet of the phase-transition chamber, 3) an inlet through which the working fluid flows into the two-phase heat transfer unit in a liquid phase, and 4) an outlet through which at least a portion of the working fluid flows out of the two-phase heat transfer unit in a vapor phase; and
a controller configured to operate the thermoelectric component and the two-phase heat transfer unit such that the two-phase heat transfer unit cools the second side of the thermoelectric component to a first temperature and the thermoelectric component changes the temperature of the target material to a second temperature within a range of 0.5−to 20 seconds, and wherein the second temperature is +/−60 ° C. of the first temperature.
 
20. A semiconductor device, comprising:
a semiconductor component having integrated circuity; and
a thermal management system including—
(a) a thermoelectric component having a first side configured to be thermally coupled to the semiconductor component and a second side opposite the first side;
(b) a two-phase heat transfer unit thermally coupled to the second side of the thermoelectric component, the two-phase heat transfer unit having 1) a phase-transition chamber having an inlet region and an outlet region, 2) microfeatures in the phase-transition chamber spaced apart from each other such the microfeatures induce capillary forces to a working fluid that drives the working fluid from the inlet region of the phase-transition chamber to the outlet of the phase-transition chamber, 3) an inlet through which the working fluid flows into the two-phase heat transfer unit in a liquid phase, and 4) an outlet through which at least a portion of the working fluid flows out of the two-phase heat transfer unit in a vapor phase; and
(c) a controller configured to operate the thermoelectric component and the two-phase heat transfer unit such that the two-phase heat transfer unit cools the second side of the thermoelectric component to a first temperature and the thermoelectric component changes the temperature of the semiconductor component to second temperature.