CPC B32B 37/182 (2013.01) [B29C 35/02 (2013.01); B29C 37/0075 (2013.01); B29C 65/02 (2013.01); B29C 66/7254 (2013.01); B29C 66/72141 (2013.01); B29C 66/7375 (2013.01); B29C 66/7392 (2013.01); B29C 66/7394 (2013.01); B29C 66/7422 (2013.01); B29C 70/30 (2013.01); B29D 99/0089 (2013.01); B32B 5/26 (2013.01); B32B 27/12 (2013.01); B32B 27/38 (2013.01); B32B 37/06 (2013.01); B32B 37/146 (2013.01); B32B 37/26 (2013.01); B29C 37/0064 (2013.01); B29C 2035/0283 (2013.01); B29K 2101/10 (2013.01); B29K 2101/12 (2013.01); B29K 2105/0809 (2013.01); B29K 2105/253 (2013.01); B29K 2307/04 (2013.01); B29K 2309/08 (2013.01); B29L 2009/00 (2013.01); B29L 2009/003 (2013.01); B32B 2037/268 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/101 (2013.01); B32B 2305/10 (2013.01); B32B 2305/72 (2013.01); B32B 2309/025 (2013.01); B32B 2315/08 (2013.01); B32B 2323/10 (2013.01); B32B 2331/00 (2013.01); B32B 2363/00 (2013.01); B32B 2367/00 (2013.01); B32B 2377/00 (2013.01); B32B 2379/00 (2013.01)] | 11 Claims |
1. A method for curing a composite panel to produce a smooth surface, comprising:
constructing a panel layup assembly upon a mold, the panel layup assembly including the composite panel, wherein the composite panel comprises at least a core and a resin formulation, and a release film between the mold and the composite panel, wherein a smooth release surface of the release film is in contact with the composite panel upon construction;
initiating curing of the composite panel at a first temperature within a lowermost ten percent of a curing temperature range of the resin formulation;
continuing curing of the composite panel at a second temperature above the lowermost ten percent of the curing temperature range; and
completing curing of the composite panel at a third temperature below the second temperature.
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