CPC B25B 11/005 (2013.01) [H01L 21/68 (2013.01); H01L 21/6838 (2013.01); H01L 21/68735 (2013.01); H01L 21/68742 (2013.01); H01L 2221/68309 (2013.01)] | 13 Claims |
1. A substrate treatment apparatus comprising:
a substrate support part provided with a seating surface and configured to support a substrate;
a guide ring annularly disposed along an edge of the substrate support part to surround the substrate; and
a centering part including a body provided inside the guide ring, the body configured to center the substrate by moving into and out of the guide ring into a space above the seating surface in a linear direction parallel to the seating surface toward a central axis of the guide ring to pressurize an edge of the substrate, the centering part further comprising at least one elastic body configured to elastically move the body with respect to the substrate support part,
wherein the centering part further includes:
a head provided at one side end of the body and configured to move together with the body to pressurize the edge of the substrate; and
the at least one elastic body comprises a plurality of elastic bodies each having one side fixed to the substrate support part and the other side connected to the body to provide an elastic force in a linear direction parallel to the seating surface away from the central axis of the guide ring to elastically move the body with respect to the substrate support part.
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