| CPC H10N 30/302 (2023.02) [G01N 3/08 (2013.01); G01N 2203/0066 (2013.01); Y10T 29/42 (2015.01)] | 10 Claims |

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1. A method for preparing a static/dynamic 3D microcrack propagation sensor, comprising:
preparing a piezoresistive/piezoelectric sensing functional component dispersed material, and then coating the piezoresistive/piezoelectric sensing functional component dispersed material to a surface of a fiber cloth substrate to obtain a piezoresistive/piezoelectric sensing fiber cloth;
performing a pre-stretching treatment on the piezoresistive/piezoelectric sensing fiber cloth, producing 3D microcrack, then obtaining a piezoresistive/piezoelectric sensing 3D microcrack fiber cloth;
ablating the piezoresistive/piezoelectric sensing 3D microcrack fiber cloth by microwave to remove the fiber cloth substrate, forming a 3D convoluted skeleton, then obtaining a piezoresistive/piezoelectric sensing 3D microcrack functional skeleton;
coating a conductive layer on both surfaces of the piezoresistive/piezoelectric sensing 3D microcrack functional skeleton, thereby forming an electrode;
polarizing the piezoresistive/piezoelectric sensing 3D microcrack functional skeleton with the formed electrodes on the surfaces; and
encapsulating the piezoresistive/piezoelectric sensing 3D microcrack functional skeleton with an elastomer to obtain a static/dynamic 3D microcrack propagation sensor.
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