US 12,426,504 B2
Solid-state cooler device with grid point contacts
John X. Przybysz, Severna Park, MD (US); Aaron Ashley Hathaway, Baltimore, MD (US); Edward R. Engbrecht, Odenton, MD (US); and Robert M. Young, Ellicott City, MD (US)
Assigned to NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US)
Filed by NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US)
Filed on Aug. 1, 2023, as Appl. No. 18/363,450.
Prior Publication US 2025/0048930 A1, Feb. 6, 2025
Int. Cl. H10N 10/17 (2023.01); F25B 21/02 (2006.01); H10N 10/01 (2023.01); H10N 10/855 (2023.01)
CPC H10N 10/17 (2023.02) [F25B 21/02 (2013.01); H10N 10/01 (2023.02); H10N 10/8552 (2023.02)] 14 Claims
OG exemplary drawing
 
1. A solid-state cooler device comprising:
a first portion having a normal metal heat sink layer and a plurality of first elongated parallel ridges disposed over the normal metal heat sink layer, the plurality of first elongated parallel ridges extending from one edge to an opposite edge of the normal metal heat sink layer; and
a second portion disposed over the first portion, the second portion having an NIS junction comprising a normal metal layer, an insulator layer and, a superconductor layer and a plurality of second elongated parallel ridges disposed over the superconductor layer of the NIS junction, the plurality of second elongated parallel ridges extending from one edge to an opposite edge of the superconductor layer,
wherein the plurality of first elongated parallel ridges are in contact and orthogonal to the plurality of second elongated parallel ridges to provide a plurality of grid point contacts.