US 12,426,428 B2
Multi-color LED pixel unit and micro-LED display panel
Qiming Li, Albuquerque, NM (US); and Qunchao Xu, Shanghai (CN)
Assigned to Jade Bird Display (Shanghai) Limited, Shanghai (CN)
Filed by JADE BIRD DISPLAY (SHANGHAI) LIMITED, Shanghai (CN)
Filed on Aug. 12, 2022, as Appl. No. 17/886,850.
Application 17/886,850 is a continuation in part of application No. 17/840,516, filed on Jun. 14, 2022.
Application 17/840,516 is a continuation in part of application No. 16/567,123, filed on Sep. 11, 2019, granted, now 11,362,133, issued on Jun. 14, 2022.
Prior Publication US 2022/0392952 A1, Dec. 8, 2022
Int. Cl. H10H 29/14 (2025.01)
CPC H10H 29/142 (2025.01) 18 Claims
OG exemplary drawing
 
1. A method for fabricating a micro light emitting diode (LED) display panel, comprising:
forming a stack structure on a wafer substrate, the stack structure comprising a first metal layer, a first type of light emitting layer, a second metal layer, and a second type of light emitting layer in an order from bottom to top;
forming a plurality of trenches in the stack structure, the plurality of trenches defining a plurality of micro LED display panel areas;
after forming the plurality of trenches in the stack structure, patterning the second type of light emitting layer and the second metal layer until portions of top surfaces of the first type of light emitting layer are exposed;
after patterning the second type of light emitting layer and the second metal layer, selectively etching the stack structure to expose a side surface of the first metal layer, thereby forming a plurality of first LEDs and a plurality of second LEDs in each of the micro LED display panel areas, each of the first LEDs including the first metal layer and the first type of light emitting layer, and each of the second LEDs including the first metal layer, the first type of light emitting layer, the second metal layer, and the second type of light emitting layer;
removing a portion of the second type of light emitting layer in at least one of the second LEDs, to expose a top portion of the second metal layer in the second LED;
forming a first electrical connector on the exposed top portion and a side wall of the second metal layer in the second LED, and on side walls of the first type of light emitting layer and the first metal layer in the second LED, to electrically connect the first metal layer and the second metal layer in the second LED; and
cutting the wafer substrate to form a plurality of micro LED display panels.