	US 12,426,418 B2
	Manufacturing method of array substrate, array substrate, and display panel
Bin Zhao, Shenzhen (CN); Juncheng Xiao, Shenzhen (CN); and Xiaodan Lin, Shenzhen (CN)
Assigned to TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., Shenzhen (CN)
Appl. No. 17/772,772
Filed by TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., Shenzhen (CN)
PCT Filed Apr. 22, 2022, PCT No. PCT/CN2022/088497 § 371(c)(1), (2) Date Apr. 28, 2022, PCT Pub. No. WO2023/193310, PCT Pub. Date Oct. 12, 2023.
Claims priority of application No. 202210367147.9 (CN), filed on Apr. 8, 2022.
Prior Publication US 2024/0162400 A1, May 16, 2024
Int. Cl. H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01); H10H 20/857 (2025.01); H10H 20/01 (2025.01)

CPC H10H 20/857 (2025.01) [H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H10D 86/443 (2025.01); H10D 86/60 (2025.01); H10H 20/032 (2025.01); H10H 20/0364 (2025.01)]

20 Claims

1. A manufacturing method of an array substrate, wherein the manufacturing method comprises following steps:

providing a base substrate;

sequentially forming a conductive layer and a photoresist layer on the base substrate;

patterning the photoresist layer and the conductive layer, wherein the patterned conductive layer comprises a conductive area and an electroplating area which are electrically connected;

removing the photoresist layer;

forming an electroplating layer on the conductive layer at a position corresponding to the electroplating area; and

disconnecting the electroplating area from the conductive area.