| CPC H10H 20/857 (2025.01) [H01L 25/167 (2013.01); H10H 20/01 (2025.01); H10H 20/0364 (2025.01)] | 14 Claims |

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1. An optoelectronic device comprising:
a semiconductor chip;
a first redistribution layer arranged over the semiconductor chip;
a second redistribution layer extending to an assembly surface of the optoelectronic device;
at least one light emitter and at least one light detector arranged over the first redistribution layer; and
a third redistribution layer arranged over the at least one light emitter and the at least one light detector;
wherein:
the first redistribution layer electrically couples the semiconductor chip to the at least one light emitter and the at least one light detector, wherein the first redistribution layer directly couples the semiconductor chip to the at least one light emitter;
the second redistribution layer is electrically coupled to the first redistribution layer, wherein the second redistribution layer is directly coupled to the first redistribution layer, and
the third redistribution layer is electrically coupled to the at least one light emitter and the at least one light detector, wherein the third redistribution layer directly couples the at least one light emitter and the at least one light detector to each other.
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