US 12,426,415 B2
Method of manufacturing an optical semiconductor device
Naoyuki Urasaki, Chikusei (JP); and Kanako Yuasa, Saitama (JP)
Assigned to Shenzhen Jufei Optoelectronics Co., Ltd., Shenzhen (CN)
Filed by Shenzhen Jufei Optoelectronics Co., Ltd., Shenzhen (CN)
Filed on Jun. 9, 2021, as Appl. No. 17/342,813.
Application 16/392,900 is a division of application No. 15/865,299, filed on Jan. 9, 2018, granted, now 10,326,063, issued on Jun. 18, 2019.
Application 15/865,299 is a division of application No. 15/603,618, filed on May 24, 2017, granted, now 10,205,072, issued on Feb. 12, 2019.
Application 15/603,618 is a division of application No. 12/303,188, granted, now 9,673,362, issued on Jun. 6, 2017, previously published as PCT/JP2007/060385, filed on May 21, 2007.
Application 17/342,813 is a continuation of application No. 17/169,054, filed on Feb. 5, 2021.
Application 17/169,054 is a continuation of application No. 16/392,900, filed on Apr. 24, 2019, granted, now 10,950,767, issued on Mar. 16, 2021.
Claims priority of application No. 2006-154652 (JP), filed on Jun. 2, 2006.
Prior Publication US 2021/0296546 A1, Sep. 23, 2021
Int. Cl. H10H 20/852 (2025.01); H10H 20/831 (2025.01); H10H 20/85 (2025.01); H10H 20/851 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01); H01L 23/00 (2006.01)
CPC H10H 20/856 (2025.01) [H10H 20/831 (2025.01); H10H 20/8506 (2025.01); H10H 20/851 (2025.01); H10H 20/852 (2025.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H10H 20/857 (2025.01)] 21 Claims
OG exemplary drawing
 
1. A method of manufacturing an optical semiconductor device, comprising:
disposing an optical semiconductor element on at least one of at least two lead electrodes of an optical semiconductor element mounting package, wherein the package comprises:
the at least two lead electrodes disposed opposite to and spaced apart from each other, each of the at least two lead electrodes having a top surface and a bottom surface, wherein the at least two lead electrodes are flat, and each of the at least two lead electrodes in its entirety is not bent; and
a resin molded part disposed on the top surfaces of the at least two lead electrodes to form a side wall continuously surrounding the optical semiconductor element, wherein the resin molded part is configured to be in contact with outer side surfaces of the at least two lead electrodes, but the resin molded part is not in contact with the bottom surfaces of the at least two lead electrodes;
wherein the resin molded part contains an inorganic filler;
wherein the package has a recessed part that serves as an optical semiconductor element mounting region;
wherein portions of the top surfaces of the at least two lead electrodes form a part of a bottom face of the recessed part;
wherein the resin molded part is composed of a thermosetting light-reflecting resin composition, the resin molded part comprises a first portion and a second portion, the first portion forms the side wall continuously surrounding the optical semiconductor element, the first portion is configured to be in contact with the outer side surfaces of the at least two lead electrodes, the second portion is filled up a space between the at least two lead electrodes so as to form the rest part of the bottom face of the recessed part, and the first portion and the second portion form a T-shape profile from a side view of the package;
wherein the thermosetting light-reflecting resin composition comprises a white pigment with hollow inorganic particles having a particle size ranges from 0.1 μm to 50 μm;
wherein length directions of the at least two lead electrodes and a length direction of the second portion of the resin molded part are parallel to each other;
wherein the bottom surfaces of the at least two lead electrodes in its entirety and a bottom surface of the second portion of the resin molded part form a bottom surface of the package, and the bottom surface of the package is a flat surface.