| CPC H10H 20/0361 (2025.01) [H10H 20/8514 (2025.01); H10H 29/0361 (2025.01); H10H 29/8514 (2025.01); B26D 2011/005 (2013.01); H10H 20/851 (2025.01)] | 9 Claims |
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1. A method of manufacturing a fluorescent substance, comprising:
forming dicing trenches on a top surface of a fluorescent substance wafer along lattice-shaped dicing lines;
grinding the top surface, on which the dicing trenches are formed, as much as a uniform thickness to remove chipping portion formed on the top surface of the wafer in the forming of the diving trenches;
filling a bonding material having fluidity in the dicing trenches,
hardening the bonding material;
a lower surface grinding operation of grinding a bottom surface opposite to the top surface of the wafer in which the dicing trenches are formed as much as a predetermined thickness using a disk-shaped grinder so that the wafer is divided into a plurality of fluorescent substances which are color conversion members for light emitting diodes (LEDs); and
removing the bonding material so that only the divided individual fluorescent substances remain,
wherein the forming of the dicing trenches includes:
a primary cutting operation of forming a side surface of each of the dicing trenches to be inclined and reduced in width inward using a bevel-type dicing blade whose width is reduced outward; and
a secondary cutting operation of additionally forming a deeper dicing trench in a bottom surface of each of the dicing trenches formed by the primary cutting operation using a dicing blade having a planar surface with a uniform width,
wherein the lower surface grinding operation is an operation of reducing a thickness of the bottom surface opposite to the top surface in which the dicing trenches are formed so that the individual fluorescent substances divided along the dicing lines are integrated only by the hardened bond material,
wherein a width of the planar dicing blade used for the secondary cutting is smaller than a width of an outermost portion of the bevel-type diving blade used for the primary cutting, and
the dicing trench is formed to be inclined to have a gradually smaller width from the top surface of the wafer to a first depth, and is formed to have a second width, the second width being smaller than a first width formed at the first depth by the bevel-type dicing blade and being uniformly formed by the planar dicing blade from the first depth to a next second depth, and
wherein the individual fluorescent substance acquired by the removing of the bonding material includes:
an inclined portion formed at a side of the individual fluorescent substance; and
a step portion continuously formed from the inclined portion at the side of the individual florescent substance.
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