US 12,426,371 B2
Sensing device
Te-Chun Huang, Hsinchu (TW); and Pei-Ming Chen, Hsinchu (TW)
Assigned to AUO Corporation, Hsinchu (TW)
Filed by AUO Corporation, Hsinchu (TW)
Filed on Aug. 8, 2022, as Appl. No. 17/882,622.
Claims priority of provisional application 63/300,734, filed on Jan. 19, 2022.
Claims priority of application No. 111121419 (TW), filed on Jun. 9, 2022.
Prior Publication US 2023/0230978 A1, Jul. 20, 2023
Int. Cl. H10D 86/60 (2025.01); H10D 8/50 (2025.01); H10D 86/40 (2025.01); H10K 59/126 (2023.01)
CPC H10D 86/60 (2025.01) [H10D 8/50 (2025.01); H10D 86/441 (2025.01); H10K 59/126 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A sensing device, having a sensing area, a peripheral area and a pad area located between the sensing area and the peripheral area, comprising:
a sensing element located in the sensing area;
a pad located in the pad area and electrically connected to the sensing element;
a metal strip located in the peripheral area, wherein an extending direction of the metal strip is parallel to an extending direction of the pad; and
a switch element electrically connected to the sensing element, wherein a source of the switch element and the metal strip belong to a same film layer.