US 12,426,312 B2
Semiconductor device and method for fabricating the same
Tea Won Kim, Hwaseong-si (KR); Hyung Joon Kim, Yongin-si (KR); Yong-Suk Tak, Seoul (KR); Yu Rim Kim, Hwaseong-si (KR); and Kong Soo Lee, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Mar. 3, 2022, as Appl. No. 17/653,390.
Claims priority of application No. 10-2021-0098390 (KR), filed on Jul. 27, 2021.
Prior Publication US 2023/0035916 A1, Feb. 2, 2023
Int. Cl. H10D 30/67 (2025.01)
CPC H10D 30/6755 (2025.01) [H10D 30/6745 (2025.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a conductive line that extends in a first direction on a substrate;
a first oxide semiconductor layer, which includes a first crystalline oxide semiconductor material containing a first metal element, on the conductive line;
a second oxide semiconductor layer, which is in physical contact with the first oxide semiconductor layer and is connected to the conductive line, on the conductive line;
a gate electrode that extends in a second direction, which crosses the first direction, on a side of the second oxide semiconductor layer; and
a capacitor structure that is connected to the second oxide semiconductor layer and is on the second oxide semiconductor layer and the gate electrode,
wherein the second oxide semiconductor layer includes a second crystalline oxide semiconductor material containing the first metal element and second and third metal elements, which are different from the first metal element.