| CPC H05K 7/20509 (2013.01) [H05K 1/0209 (2013.01); H05K 7/20154 (2013.01); H05K 7/20254 (2013.01); H05K 2201/064 (2013.01)] | 20 Claims |

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1. A method comprising:
providing a combined liquid and air cooling system over a printed circuit board (PCB) of an electronic device, the PCB including a plurality of components including an integrated circuit package and at least one other component, the integrated circuit package comprising an application specific integrated circuit (ASIC) die and a plurality of high bandwidth memory (HBM) modules, and the combined liquid and air cooling system comprising a liquid cooling system located over the integrated circuit package and an air cooling system integrated with the liquid cooling system and a portion of the PCB; and
in a first mode of operation:
providing a flow of a coolant fluid within a closed recirculation loop and through a cold plate of the liquid cooling system to cool the ASIC die and the plurality of HBM modules of the integrated circuit package during operation of the electronic device; and
directing, via an airflow device of the air cooling system, a flow of air at different flow rates through a plurality of heat sinks of the air cooling system to cool the plurality of components of the PCB, wherein a direction of the flow of air through the plurality of heat sinks at the different flow rates is transverse to a direction of the flow of the coolant fluid, wherein the combined liquid and air cooling system utilizes the air cooling system to cool the at least one other component.
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