US 12,426,210 B2
Systems and methods for supporting a high thermal gradient between a qubit plane and a control system for the qubit plane using a superconducting rigid-flex circuit
Matthew David Turner, Carnation, WA (US); Craig Steven Ranta, Olympia, WA (US); and Kevin James Kramer, Redmond, WA (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on Aug. 14, 2023, as Appl. No. 18/449,329.
Prior Publication US 2025/0063650 A1, Feb. 20, 2025
Int. Cl. H05K 7/20 (2006.01); H01B 12/16 (2006.01); H05K 1/02 (2006.01)
CPC H05K 7/20372 (2013.01) [H01B 12/16 (2013.01); H05K 1/0203 (2013.01); H05K 7/20254 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system comprising:
a qubit plane having at least one qubit chip associated with a first rigid circuit portion of a superconducting rigid-flex circuit;
a first cooling system operable to maintain an operating temperature for the qubit plane and the first rigid circuit portion of the superconducting rigid-flex circuit at or below 100 milli-kelvin;
a control system having at least one control chip associated with a second rigid circuit portion of the superconducting rigid-flex circuit;
a second cooling system operable to maintain an operating temperature for the control system and the second rigid circuit portion of the superconducting rigid-flex circuit at or below 10 kelvin, allowing the at least one control chip to dissipate heat to the second cooling system within a thermal budget commensurate with an amount of power required to provide control signals to control qubits within the at least one qubit chip; and
a flexible circuit portion of the superconducting rigid-flex circuit for interconnecting the first rigid circuit portion of the superconducting rigid-flex circuit with the second rigid circuit portion of the superconducting rigid-flex circuit.