US 12,426,207 B2
Immersion fluid module and server system
Zi Ping Wu, New Taipei (TW); Jun Da Chen, New Taipei (TW); Ting-Yu Pai, New Taipei (TW); Yi Cheng, New Taipei (TW); and Chin-Hao Hsu, New Taipei (TW)
Assigned to Wiwynn Corporation, New Taipei (TW)
Filed by Wiwynn Corporation, New Taipei (TW)
Filed on Oct. 3, 2023, as Appl. No. 18/479,831.
Claims priority of application No. 112102495 (TW), filed on Jan. 19, 2023.
Prior Publication US 2024/0251530 A1, Jul. 25, 2024
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/203 (2013.01) [H05K 7/20318 (2013.01); H05K 7/20818 (2013.01); H05K 7/20836 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An immersion fluid module comprising:
a tank containing a first fluid, an electronic device disposed in the tank, and the electronic device at least partially immersed in the first fluid in a liquid state;
a heat exchanger disposed in the tank, and the heat exchanger at least partially immersed in the first fluid in the liquid state;
a condenser disposed in the tank; and
at least one pipe connecting the heat exchanger and the condenser, a second fluid provided to the at least one pipe, and a temperature of the second fluid being higher than a preset value,
wherein when an ambient temperature where the electronic device is placed is lower than the preset value, the second fluid flows through the heat exchanger, and transfers heat to the first fluid through the heat exchanger to raise the ambient temperature where the electronic device is placed.