US 12,426,177 B2
Buffer module and electronic device using the same
Cun-Hong Deng, Taipei (TW); Ming-Te Lin, Taipei (TW); and Chi-Ming Tsai, Taipei (TW)
Assigned to PEGATRON CORPORATION, Taipei (TW)
Filed by Pegatron Corporation, Taipei (TW)
Filed on Dec. 8, 2022, as Appl. No. 18/063,121.
Claims priority of application No. 111102762 (TW), filed on Jan. 22, 2022.
Prior Publication US 2023/0240025 A1, Jul. 27, 2023
Int. Cl. H05K 5/02 (2006.01); F16F 15/02 (2006.01); F16F 15/04 (2006.01); F16F 15/067 (2006.01); G06F 1/16 (2006.01); H05K 7/14 (2006.01)
CPC H05K 5/0217 (2013.01) [F16F 15/02 (2013.01); F16F 15/04 (2013.01); F16F 15/067 (2013.01); H05K 7/142 (2013.01); H05K 7/1427 (2013.01); G06F 1/1656 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A buffer module, comprising:
a base comprising a groove, a first through hole and a second through hole;
a buffer element comprising a spherical body movably disposed in the groove;
an elastic element disposed between a bottom surface of the groove and the spherical body; and
a limiting element comprising a first terminal portion, a second terminal portion and a surrounding portion, the first terminal portion and the second terminal portion connected to the surrounding portion, wherein the first terminal portion and the second terminal portion pass through the first through hole and the second through hole of the base, respectively, to connect the spherical body, and the surrounding portion surrounds a part of an outer peripheral surface of the base.