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1. A circuit board, comprising: a first metal layer, forming a plurality of first reference conductive wires; a second metal layer, forming at least one signal transmission wire; and a third metal layer, forming a plurality second reference conductive wires, wherein the first metal layer, the second metal layer, and the third metal layer are overlapped with each other, each of the first reference conductive wires is not completely overlapped with each of the second reference conductive wires, the signal transmission wire is partially overlapped with the first reference conductive wires and the second reference conductive wires, and the first reference conductive wires and the second reference conductive wires are arranged to increase an area of partially overlapping regions between the signal transmission wire, the first reference conductive wires and second reference conductive wires, wherein an extension direction of each of the plurality of first reference conductive wires is not orthogonal to an extension direction of each of the plurality of second reference conductive wires; wherein the first reference conductive wires and the second reference conductive wires receive a reference ground voltage.
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