US 12,426,147 B2
Electronic device
Chih-Wen Lu, Hsinchu (TW); Fan-Yu Chen, Hsinchu (TW); Chun-Yueh Hou, Hsinchu (TW); and Hsi-Hung Chen, Hsinchu (TW)
Assigned to AUO Corporation, Hsinchu (TW)
Filed by AUO Corporation, Hsinchu (TW)
Filed on Oct. 4, 2023, as Appl. No. 18/480,523.
Claims priority of application No. 111141463 (TW), filed on Oct. 31, 2022.
Prior Publication US 2024/0147639 A1, May 2, 2024
Int. Cl. H05K 1/02 (2006.01); H05K 3/28 (2006.01)
CPC H05K 1/02 (2013.01) [H05K 3/285 (2013.01); H05K 2201/02 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a substrate, having a first surface, a second surface, and a side surface connected between the first surface and the second surface;
a side wiring, disposed on the substrate and extending from the first surface to the second surface through the side surface;
a protective film, disposed on the side wiring, wherein the side wiring is sandwiched between the substrate and the protective film, an edge of the protective film extends beyond a side wall of the side wiring, and the protective film, the side wall of the side wiring, and the substrate define a gap; and
a first filler, disposed on the protective film and in the gap, wherein the first filler comprises a first material and a plurality of particles mixed within the first material.