US 12,425,778 B2
Semiconductor integrated circuit device and microphone module using same
Naoyuki Motoki, Fujimino (JP)
Assigned to NISSHINBO MICRO DEVICES INC., Tokyo (JP)
Appl. No. 18/248,718
Filed by NISSHINBO MICRO DEVICES INC., Tokyo (JP)
PCT Filed Oct. 28, 2021, PCT No. PCT/JP2021/039785
§ 371(c)(1), (2) Date Apr. 12, 2023,
PCT Pub. No. WO2022/092187, PCT Pub. Date May 5, 2022.
Claims priority of application No. 2020-181647 (JP), filed on Oct. 29, 2020.
Prior Publication US 2023/0396933 A1, Dec. 7, 2023
Int. Cl. H04R 19/04 (2006.01); H04R 3/00 (2006.01); H04R 19/00 (2006.01)
CPC H04R 19/04 (2013.01) [H04R 19/005 (2013.01); H04R 2201/003 (2013.01); H04R 2410/03 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A semiconductor integrated circuit device capable of inputting a signal of a MEMS transducer, the semiconductor integrated circuit device comprising:
a power supply circuit for a MEMS transducer;
an input amplifier for inputting and amplifying a signal of the MEMS transducer;
a line driver for amplifying an output from the input amplifier and allowing for driving of a load connected to an output terminal; and
the output terminal for outputting an output of the line driver,
wherein the power supply circuit, the input amplifier, and the line driver are integrally formed on a semiconductor substrate, and
wherein a gain setting circuit for determining gain of the line driver and a DC potential of the output terminal is connected to an input terminal of the line driver.