US 12,425,759 B2
Multi-mic earphone design and assembly
John Keady, Fairfax Station, VA (US)
Assigned to ST R&DTech LLC, Delray Beach, FL (US)
Filed by ST R&DTech, LLC, Delray Beach, FL (US)
Filed on Jan. 14, 2022, as Appl. No. 17/576,905.
Application 17/576,905 is a continuation of application No. 16/984,299, filed on Aug. 4, 2020, granted, now 11,277,681.
Application 16/984,299 is a continuation of application No. 16/380,966, filed on Apr. 10, 2019, granted, now 10,805,709, issued on Oct. 13, 2020.
Prior Publication US 2022/0141569 A1, May 5, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H04R 1/10 (2006.01)
CPC H04R 1/1041 (2013.01) [H04R 1/1016 (2013.01); H04R 1/1075 (2013.01); H04R 1/1083 (2013.01); H04R 2420/07 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method of earphone fabrication comprising:
selecting a standardized electronic package;
selecting a CAD earphone housing design from a set of multiple designs that are not customized to a specific user's ear geometry, wherein the multiple designs, available for selection, are only designs that are designed to accept the selected standardized electronic package, wherein the standard electronic package includes an electronic package housing, a processor, and a speaker, a first microphone configured to sample an ambient environment around the earphone, and a second microphone configured so that when the standard electronic package is inserted into the earphone housing the second microphone is configured to sample an acoustic channel in the earphone housing that sample's a user's ear canal when the earphone is inserted into the user's ear;
converting the selected CAD earphone housing design into a 3D printer format file;
sending the 3D printer format file to a 3D printer to have earphone parts 3D printed;
assembling the earphone parts to form an earphone housing, wherein the earphone housing has a first, second and third part, wherein the first, second and third parts are configured to fit together encompassing the standardized electronic package, wherein the first part is flexible with a Shore A less than 65 and contains a stent, wherein the second part has a Shore A greater than 65 and contains openings for user interfaces, and wherein the third part connects the first part with the second part; and
inserting the standard electronic package into the earphone housing to form the earphone, wherein the earphone housing includes a stent configured to accept and eartip.