| CPC H01R 43/027 (2013.01) [B32B 17/10385 (2013.01); B32B 17/10761 (2013.01); B32B 37/1207 (2013.01); B32B 38/145 (2013.01); C03C 27/10 (2013.01); H01R 4/04 (2013.01); B32B 2037/1253 (2013.01); B32B 2307/202 (2013.01); B32B 2315/08 (2013.01); B32B 2605/006 (2013.01); H01R 2201/26 (2013.01)] | 13 Claims |

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1. A method of manufacturing a window assembly having a solderless electrical connector, said method comprising:
forming a transparent substrate that is curved;
digitally-applying a conductive ink having a thermal degradation temperature without a mask onto a surface of the curved transparent substrate to form an applied conductive ink on the surface of the curved transparent substrate;
providing a molded insulating cover and a biasing member coupled to the molded insulating cover, with the biasing member having a first end and an opposing second end, and
applying an adhesive onto the surface of the curved transparent substrate adjacent to the applied conductive ink;
coupling the molded cover to the adhesive with the first end of the biasing member being in electrical communication with the applied conductive ink and with the biasing member being elastically compressed between the molded insulating cover and the applied conductive ink; and
curing the adhesive at a temperature below the thermal degradation temperature of the applied conductive ink to form the solderless electrical connector in electrical contact with the applied conductive ink.
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