US 12,424,764 B2
RF module for antenna and antenna apparatus comprising same
Duk Yong Kim, Yongin-si (KR); Young Chan Moon, Suwon-si (KR); Joon Hyong Shim, Yongin-si (KR); Sung Hwan So, Hwaseong-si (KR); Bae Mook Jeong, Suwon-si (KR); Min Seon Yun, Anyang-si (KR); Kyo Sung Ji, Hwaseong-si (KR); Chi Back Ryu, Hwaseong-si (KR); Sung Ho Jang, Hwaseong-si (KR); Jae Hong Kim, Yongin-si (KR); Oh Seog Choi, Yongin-si (KR); and Yong Won Seo, Daejeon (KR)
Assigned to KMW INC., Hwaseong-si (KR)
Filed by KMW INC., Hwaseong-si (KR)
Filed on Jun. 8, 2023, as Appl. No. 18/207,575.
Application 18/207,575 is a continuation of application No. PCT/KR2021/018509, filed on Dec. 8, 2021.
Claims priority of application No. 10-2020-0170576 (KR), filed on Dec. 8, 2020; and application No. 10-2021-0174364 (KR), filed on Dec. 8, 2021.
Prior Publication US 2023/0327345 A1, Oct. 12, 2023
Int. Cl. H01Q 21/06 (2006.01); H01Q 1/02 (2006.01); H01Q 1/42 (2006.01); H01Q 15/14 (2006.01); H01Q 21/00 (2006.01); H01Q 23/00 (2006.01); H03F 1/30 (2006.01); H03F 3/19 (2006.01); H01Q 1/24 (2006.01)
CPC H01Q 21/0025 (2013.01) [H01Q 1/02 (2013.01); H01Q 1/42 (2013.01); H01Q 15/141 (2013.01); H01Q 23/00 (2013.01); H03F 1/30 (2013.01); H03F 3/19 (2013.01); H01Q 1/246 (2013.01); H03F 2200/447 (2013.01); H03F 2200/451 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An antenna RF module comprising:
an RF filter arranged on a front surface of a main board;
a radiation element module arranged on a front surface of the RF filter; and
an amplification element module comprising:
an amplification unit body arranged between the main board and the RF filer and having a board seating space that is open at one side or the other side in a width direction;
an amplification unit board seated inside the amplification unit body, a front end portion of an edge of the amplification unit board being connected to the RF filter for signal transmission, a rear end portion of the edge thereof being connected to the main board for signal transmission, and at least one analog amplification element being mounted on one surface or the other surface thereof; and
an amplification unit cover provided in such a manner as to cover the amplification unit board,
wherein heat generated from the at least one analog amplification element on the amplification unit board is distributively dissipated to outside air in front of one side or the other side, in a width direction, of the amplification element module through a multiplicity of amplification-unit heat sink pins integrally formed on an outer surface of the amplification unit body and through a multiplicity of amplification-unit-cover heat sink pins integrally formed on an outer surface of the amplification unit cover.