US 12,424,732 B2
Electronic device comprising antenna
Seongjin Park, Suwon-si (KR); Hosaeng Kim, Suwon-si (KR); Sumin Yun, Suwon-si (KR); Chaejun Lee, Suwon-si (KR); Woomin Jang, Suwon-si (KR); Myunghun Jeong, Suwon-si (KR); Jehun Jong, Suwon-si (KR); and Jaehoon Jo, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Dec. 5, 2022, as Appl. No. 18/074,952.
Application 18/074,952 is a continuation of application No. PCT/KR2021/007020, filed on Jun. 4, 2021.
Claims priority of application No. 10-2020-0068649 (KR), filed on Jun. 5, 2020.
Prior Publication US 2023/0094039 A1, Mar. 30, 2023
Int. Cl. H01Q 1/46 (2006.01); H01Q 1/24 (2006.01); H01Q 1/48 (2006.01); H01Q 9/04 (2006.01); H01Q 21/06 (2006.01)
CPC H01Q 1/243 (2013.01) [H01Q 1/48 (2013.01); H01Q 9/045 (2013.01); H01Q 21/062 (2013.01); H01Q 21/065 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a printed circuit board (PCB) including a plurality of layers including a first layer and a second layer;
a plurality of patch antennas including a first patch antenna;
a communication circuit electrically coupled to the PCB; and
at least one processor electrically coupled to the communication circuit,
wherein the PCB includes:
the first layer in which the plurality of patch antennas are disposed,
a first feeding path which feeds power directly or indirectly to a first point of the first patch antenna such that the first patch antenna disposed in the first layer transmits and/or receives a first polarized signal,
wherein the first feeding path includes a via penetrating a first number of layers among the plurality of layers and is electrically coupled to the communication circuit,
a second feeding path which feeds power directly or indirectly to a second point of the first patch antenna such that the first patch antenna disposed in the first layer transmits and/or receives a second polarized signal orthogonal to the first polarized signal,
wherein the second feeding path includes a via penetrating the first number of layers among the plurality of layers and is electrically coupled to the communication circuit,
the second layer including a ground,
a first ground path which electrically connects the ground and a third point adjacent to the first point of the first patch antenna, wherein the third point is disposed from the outside of the first patch antenna, and
a second ground path which electrically connects the ground and a fourth point adjacent to the second point of the first patch antenna, wherein the fourth point is disposed from the outside of the first patch antenna.