US 12,424,730 B2
Antenna package for signal transmission
Feng-Wei Kuo, Zhudong Township (TW); and Wen-Shiang Liao, Toufen Township (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd.
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jul. 31, 2023, as Appl. No. 18/228,324.
Application 18/228,324 is a continuation of application No. 17/392,680, filed on Aug. 3, 2021, granted, now 11,791,534.
Application 17/392,680 is a continuation of application No. 16/701,938, filed on Dec. 3, 2019, granted, now 11,114,745, issued on Sep. 7, 2021.
Claims priority of provisional application 62/908,230, filed on Sep. 30, 2019.
Prior Publication US 2023/0378636 A1, Nov. 23, 2023
Int. Cl. H01Q 1/22 (2006.01); H01L 21/027 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01L 21/0273 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/293 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/66 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A structure, comprising:
a substrate comprising a dielectric layer;
an interconnect structure disposed on the substrate;
a through-via extending from the interconnect structure to the substrate;
a through-via grating disposed adjacent to the through-via and extending from the interconnect structure to the substrate,
wherein the through-via grating comprises an array of through-vias arranged in a series configuration,
wherein each through-vias in the array of through-vias comprises a first metal layer and a second metal layer surrounded by the first metal layer, and
wherein bottom surfaces of the through-via and through-via grating are in contact with a top surface of the substrate; and
an antenna region disposed between the through-via and through-via grating.