| CPC H01Q 1/2283 (2013.01) [H01Q 21/0025 (2013.01)] | 20 Claims |
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1. An electronic device comprising:
a radio frequency integrated circuit (RFIC) chip; and
an antenna array electrically connected to the RFIC chip, the antenna array including a first face and a second face facing each other in a first direction, and a third face and a fourth face connecting the first and second faces to each other and facing each other in a second direction intersecting the first direction,
the antenna array including
a plurality of substrates sequentially stacked in a third direction intersecting a plane defined by the first and second directions,
first and second antenna modules on the plurality of substrates and sequentially arranged along the first direction,
a first metal partition-wall including at least one metal via extending through the plurality of substrates in the third direction, and
a second metal partition-wall surrounding the first to fourth faces, the first and second antenna modules, and the first metal partition-wall, and
wherein the first metal partition-wall is arranged at a periphery of each of the first and second antenna modules but does not completely surround each of the first and second antenna modules.
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