US 12,424,716 B2
RF filters and multiplexers manufactured in the core of a package substrate using glass core technology
Aleksandar Aleksov, Chandler, AZ (US); Neelam Prabhu Gaunkar, Chandler, AZ (US); Veronica Strong, Hillsboro, OR (US); Georgios C. Dogiamis, Chandler, AZ (US); and Telesphor Kamgaing, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 22, 2021, as Appl. No. 17/354,903.
Prior Publication US 2022/0407199 A1, Dec. 22, 2022
Int. Cl. H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01P 1/20 (2006.01); H05K 1/02 (2006.01)
CPC H01P 1/2002 (2013.01) [H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H05K 1/0243 (2013.01); H05K 2201/1006 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A package substrate, comprising:
a core with a first surface and a second surface, the core having a thickness between the first surface and the second surface; and
a filter embedded in the core, wherein the filter comprises:
a ground plane, wherein the ground plane extends from the first surface to the second surface through the thickness of the core; and
a resonator laterally spaced apart from the ground plane, wherein the resonator extends from the first surface to the second surface through the thickness of the core.