US 12,424,596 B2
Optoelectronic package structure and method of manufacturing the same
Hsiang-Cheng Tsai, Kaohsiung (TW); and Jui-Che Wu, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Oct. 28, 2021, as Appl. No. 17/513,748.
Prior Publication US 2023/0136046 A1, May 4, 2023
Int. Cl. H01L 27/146 (2006.01); H01L 23/13 (2006.01); H01L 25/16 (2023.01)
CPC H01L 25/167 (2013.01) [H01L 23/13 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An optoelectronic package structure, comprising:
a supportive structure; and
a photonic component disposed on the supportive structure,
wherein the photonic component comprises an optical portion and the optical portion of the photonic component overhangs an edge of the supportive structure,
wherein the supportive structure has an extension portion extending outwardly with respect to the edge of the supportive structure, and a length of the extension portion is greater than an overhang distance of the optical portion, and
wherein the supportive structure comprises a carrier and an electronic component, and the electronic component is located between the carrier and the photonic component in the case that the supportive structure comprises the carrier and the electronic component.