US 12,424,588 B2
Method and apparatus for trimming micro electronic element
Yen-Mu Chen, MiaoLi County (TW)
Assigned to PlayNitride Display Co., Ltd., MiaoLi County (TW)
Filed by PlayNitride Display Co., Ltd., MiaoLi County (TW)
Filed on Sep. 22, 2022, as Appl. No. 17/950,106.
Claims priority of application No. 111132413 (TW), filed on Aug. 29, 2022.
Prior Publication US 2024/0071992 A1, Feb. 29, 2024
Int. Cl. H01L 23/00 (2006.01); B23K 1/005 (2006.01); B23K 26/06 (2014.01); B23K 26/0622 (2014.01); B23K 26/351 (2014.01); B23K 101/36 (2006.01); H01L 21/66 (2006.01); H01L 25/065 (2023.01); H01L 25/075 (2006.01)
CPC H01L 24/98 (2013.01) [B23K 1/0056 (2013.01); B23K 26/0608 (2013.01); B23K 26/0622 (2015.10); B23K 26/351 (2015.10); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/799 (2013.01); H01L 24/81 (2013.01); H01L 25/0655 (2013.01); H01L 25/0753 (2013.01); B23K 2101/36 (2018.08); H01L 22/22 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/7999 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/98 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for trimming a micro electronic element, comprising:
providing a substrate, wherein at least one micro electronic element is disposed on the substrate;
heating an interface of the substrate and the micro electronic element by a first pulse laser beam to reduce a bonding force between the micro electronic element and the substrate; and
irradiating a surface layer of the micro electronic element by a second pulse laser beam to generate a shock wave due to plasma on the surface layer of the micro electronic element, wherein the shock wave removes the micro electronic element away from the substrate.