US 12,424,585 B2
Apparatus for bonding chip band and method for bonding chip using the same
Euisun Choi, Hwaseong-si (KR); Huijae Kim, Jeju-si (KR); Mingu Lee, Cheonan-si (KR); Hyeonggyun Cheong, Suwon-si (KR); and Yunpyo Hong, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Nov. 16, 2022, as Appl. No. 17/988,469.
Claims priority of application No. 10-2021-0162166 (KR), filed on Nov. 23, 2021.
Prior Publication US 2023/0163094 A1, May 25, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 21/683 (2006.01)
CPC H01L 24/80 (2013.01) [H01L 21/6838 (2013.01); H01L 24/74 (2013.01); H01L 24/08 (2013.01); H01L 24/32 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 2224/08221 (2013.01); H01L 2224/32221 (2013.01); H01L 2224/75304 (2013.01); H01L 2224/75312 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75824 (2013.01); H01L 2224/7592 (2013.01); H01L 2224/80093 (2013.01); H01L 2224/8018 (2013.01); H01L 2224/80201 (2013.01); H01L 2224/80894 (2013.01); H01L 2224/80908 (2013.01); H01L 2224/83093 (2013.01); H01L 2224/8318 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83908 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A chip bonding apparatus, comprising:
a body;
a substrate conveyor installed on the body to transfer a substrate;
a bonding head conveyor disposed on an upper surface of the body;
an alignment unit installed on the body configured to adjust a position of the substrate and a position of a chip; and
a bonding head attached to the bonding head conveyor to move the chip attached therebelow,
wherein the bonding head is provided with a chip bonding unit for attaching the chip, including:
a chip bonding unit body having an installation groove formed therein;
a pushing module having one end portion inserted into the installation groove; and
an attachment module having a deformable member provided with a deformable portion which is deformable from pressure exerted by the pushing module, the deformable portion having a bottom surface configured to contact the chip when the chip is attached to the chip bonding unit, and
wherein the attachment module comprises an attachment module body having an opening into which a second end portion of the pushing module is inserted, and the deformable member is fully inserted into the attachment module body and provided with the deformable portion that is deformable by the pushing module.