US 12,424,526 B2
Semiconductor device and power conversion device
Shogo Shibata, Tokyo (JP); Shuhei Yokoyama, Tokyo (JP); and Naoki Ikeda, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on May 31, 2022, as Appl. No. 17/828,886.
Claims priority of application No. 2021-191283 (JP), filed on Nov. 25, 2021.
Prior Publication US 2023/0163052 A1, May 25, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 23/31 (2006.01); H02P 27/08 (2006.01)
CPC H01L 23/49562 (2013.01) [H01L 23/3107 (2013.01); H01L 23/4952 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H02P 27/08 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a plurality of semiconductor chips;
a plurality of control terminals connected to the plurality of semiconductor chips;
a plurality of main terminals connected to the plurality of semiconductor chips and having larger width than the control terminals; and
sealing resin sealing the plurality of semiconductor chips, parts of the plurality of control terminals, and parts of the plurality of main terminals,
wherein the sealing resin is rectangular in a plan view and includes a first side surface and a second side surface opposed to each other,
the plurality of control terminals are drawn out from the first side surface of the sealing resin,
the plurality of main terminals are drawn out from the second side surface of the sealing resin,
each of the main terminals includes, in the sealing resin, a bonding section wire-connected to one of the semiconductor chips, a heat transfer section adjacent to the bonding section, and a mounting section on which an other one of the semiconductor chips is mounted,
a concave section is provided on the second side surface between the main terminals adjacent to each other,
a side surface of the heat transfer section is opposed to the concave section in a first direction extending from the first side surface to the second side surface,
the bonding section includes plural side surfaces,
one of the side surfaces of the bonding section is opposed to the concave section in a second direction perpendicular to the first direction, and
none of the side surfaces of the bonding section are opposed to the concave section in the first direction.