US 12,424,524 B2
Semiconductor devices and methods of manufacturing semiconductor devices
Shaun Bowers, Gilbert, AZ (US); Yoshio Matsuda, Chandler, AZ (US); Hyung Il Jeon, Gyeonggi-do (KR); Byong Jin Kim, Seoul (KR); Gi Jeong Kim, Gyeonggi-do (KR); Jae Min Bae, Seoul (KR); Seung Woo Lee, Incheon (KR); and Yong Ho Son, Incheon (KR)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Oct. 13, 2020, as Appl. No. 17/069,513.
Claims priority of provisional application 63/091,021, filed on Oct. 13, 2020.
Prior Publication US 2022/0115304 A1, Apr. 14, 2022
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01)
CPC H01L 23/49548 (2013.01) [H01L 21/4825 (2013.01); H01L 21/4828 (2013.01); H01L 21/4842 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 23/3178 (2013.01); H01L 23/3192 (2013.01); H01L 23/492 (2013.01); H01L 23/49517 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/49582 (2013.01); H01L 23/49811 (2013.01); H01L 23/5385 (2013.01); H01L 24/16 (2013.01); H01L 25/105 (2013.01); H01L 23/3107 (2013.01); H01L 23/36 (2013.01); H01L 23/49816 (2013.01); H01L 25/0652 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32257 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01)] 13 Claims
OG exemplary drawing
 
11. An electronic device, comprising:
a substrate comprising a first side and a second side, a first lead on the second side, and a cavity in the second side adjacent to the first lead;
an electronic component in the cavity and comprising a first terminal, a second terminal, and a third terminal; and
a device encapsulant in the cavity and contacting the first side of the substrate, a lateral side of the electronic component, and a first internal lateral side of the first lead in the cavity;
wherein:
the first lead comprises a groove in a first external lateral side of the first lead, the groove comprising a horizontal portion and a vertical portion;
the substrate comprises a plating contacting the first lead, the first terminal, and the second terminal; and
the plating contacts the first external lateral side of the first lead on the horizontal portion and the vertical portion of the groove.