US 12,424,514 B2
Power module apparatus, cooling structure, and electric vehicle or hybrid electric vehicle
Katsuhiko Yoshihara, Kyoto (JP); and Masao Saito, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Filed by ROHM CO., LTD., Kyoto (JP)
Filed on Nov. 9, 2023, as Appl. No. 18/505,325.
Application 18/505,325 is a continuation of application No. 17/114,020, filed on Dec. 7, 2020, granted, now 11,854,937.
Application 17/114,020 is a continuation of application No. 16/511,696, filed on Jul. 15, 2019, granted, now 11,011,454, issued on May 18, 2021.
Application 16/511,696 is a continuation of application No. 15/997,195, filed on Jun. 4, 2018, granted, now 10,403,561, issued on Sep. 3, 2019.
Application 15/997,195 is a continuation of application No. PCT/JP2016/080658, filed on Oct. 17, 2016.
Claims priority of application No. 2015-237458 (JP), filed on Dec. 4, 2015.
Prior Publication US 2024/0079293 A1, Mar. 7, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/473 (2006.01); B60K 1/00 (2006.01); B60K 11/02 (2006.01); F28F 3/04 (2006.01); H01L 23/10 (2006.01); H01L 23/367 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2023.01); H02M 7/00 (2006.01); H05K 7/20 (2006.01); B60K 6/22 (2007.10); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H02M 1/32 (2007.01); H02M 7/5387 (2007.01); H10D 12/00 (2025.01); H10D 30/66 (2025.01); H10D 62/832 (2025.01); H10D 84/00 (2025.01)
CPC H01L 23/473 (2013.01) [B60K 1/00 (2013.01); B60K 11/02 (2013.01); F28F 3/04 (2013.01); H01L 23/10 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49551 (2013.01); H01L 23/49555 (2013.01); H01L 23/49838 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H02M 7/003 (2013.01); H05K 7/2089 (2013.01); H05K 7/209 (2013.01); H05K 7/20927 (2013.01); B60K 2001/003 (2013.01); B60K 6/22 (2013.01); B60Y 2200/91 (2013.01); B60Y 2200/92 (2013.01); F28F 2230/00 (2013.01); H01L 23/3672 (2013.01); H01L 24/32 (2013.01); H01L 25/165 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/49113 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14252 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H02M 1/327 (2021.05); H02M 7/5387 (2013.01); H10D 12/441 (2025.01); H10D 30/66 (2025.01); H10D 30/668 (2025.01); H10D 62/8325 (2025.01); H10D 84/143 (2025.01); Y10S 903/904 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A power module device comprising:
a semiconductor device configured to switch electric power;
a first terminal group connected to a power terminal or an output terminal of the semiconductor device;
a second terminal group connected to a control terminal or a sense terminal of the semiconductor device;
a sealing body configured to seal a perimeter of the semiconductor device and a part of the first terminal group and the second terminal group; and
a heat radiator bonded to a heat radiator bonded surface which is one surface side of the sealing body and having heat radiation pins or heat radiation fins protruding in a direction at the heat radiator bonded surface side, wherein
the first terminal group extends only in a first horizontal direction which is a direction parallel to the heat radiator bonded surface, and
the first terminal group extends outside an outer periphery of the heat radiation body in plan view.