US 12,424,513 B2
Technologies for isolated heat dissipating devices
Prabhakar Subrahmanyam, San Jose, CA (US); Tong Wa Chao, San Jose, CA (US); Ying-Feng Pang, San Jose, CA (US); Yi Xia, Campbell, CA (US); Rahima K. Mohammed, San Jose, CA (US); Victor P. Polyanko, San Jose, CA (US); Ridvan A. Sahan, Sunnyvale, CA (US); Guangying Zhang, Shanghai (CN); Guoliang Ying, Shanghai (CN); Chuanlou Wang, Shanghai (CN); Jun Lu, Shanghai (CN); Liguang Du, Shanghai (CN); Peng Wei, Shangha (CN); and Xiang Que, Shanghai (CN)
Assigned to Intel Corporation, Santa Clara, CA (US)
Appl. No. 18/034,133
Filed by Intel Corporation, Santa Clara, CA (US)
PCT Filed Mar. 6, 2021, PCT No. PCT/CN2021/079425
§ 371(c)(1), (2) Date Apr. 27, 2023,
PCT Pub. No. WO2022/187986, PCT Pub. Date Sep. 15, 2022.
Prior Publication US 2023/0420338 A1, Dec. 28, 2023
Int. Cl. H01L 23/473 (2006.01); G06F 1/20 (2006.01); H01L 23/367 (2006.01)
CPC H01L 23/473 (2013.01) [G06F 1/206 (2013.01); H01L 23/3672 (2013.01); G06F 2200/201 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A system comprising:
a first water block including a first base, the first water block including a first inlet and a first outlet, the first inlet is connected to the first outlet by a first internal channel defined in the first water block, the first base has a gap;
a second water block including a second base, the second water block including a second inlet and a second outlet, the second inlet is connected to the second outlet by a second internal channel defined in the second water block, the second water block includes a pedestal extending from the second base and through the gap in the first base; and
a fastener mechanically coupling the first water block to the second water block.