US 12,424,510 B2
Semiconductor apparatus including cooler for cooling semiconductor element
Yushi Sato, Kawasaki (JP)
Assigned to FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed by FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed on Apr. 11, 2024, as Appl. No. 18/633,183.
Application 18/633,183 is a continuation of application No. 17/039,710, filed on Sep. 30, 2020, granted, now 12,009,279.
Application 17/039,710 is a continuation of application No. PCT/JP2019/035398, filed on Sep. 9, 2019.
Claims priority of application No. 2018-188532 (JP), filed on Oct. 3, 2018.
Prior Publication US 2024/0258194 A1, Aug. 1, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/367 (2006.01); H01L 23/473 (2006.01)
CPC H01L 23/3677 (2013.01) [H01L 23/473 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor apparatus provided with a semiconductor element and a cooler for cooling the semiconductor element, wherein the cooler comprises:
a cooling case including a pair of first and second side walls, a pair of third and fourth side walls, an introduction port provided on the first side wall, and a discharge port provided on the second side wall;
a heat dissipation board provided between the semiconductor element and the cooling case; and
metal protrusions provided on a lower surface of the heat dissipation board,
wherein a recess defines a portion through which a cooling medium flows from the introduction port to the discharge port, and
wherein the metal protrusions accommodated in the recess are substantially point-symmetric and are asymmetrically provided with respect to a center line extending between the third and fourth side walls.