US 12,424,481 B2
Modular substrate support assembly
Arvinder Manmohan Singh Chadha, San Jose, CA (US); Vijay D. Parkhe, San Jose, CA (US); Glen T Mori, Gilroy, CA (US); and Christopher Laurent Beaudry, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Feb. 21, 2024, as Appl. No. 18/583,664.
Claims priority of provisional application 63/540,001, filed on Sep. 22, 2023.
Prior Publication US 2025/0105051 A1, Mar. 27, 2025
Int. Cl. H01L 21/68 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/68785 (2013.01) [H01L 21/67103 (2013.01); H01L 21/67248 (2013.01); H01L 21/6833 (2013.01); H01L 21/68757 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A substrate support assembly, comprising:
a first puck plate comprising one or more first functional elements;
a second puck plate comprising one or more second functional elements; and
at least one of an interface layer at least partially bonding the first puck plate to the second puck plate or one or more mechanical fasteners that fasten the first puck plate to the second puck plate, and wherein a bottom surface of the first puck plate comprises a first one of a male mating component or a female mating component and a top surface of the second puck plate comprises a second one of the male mating component or the female mating component.