US 12,424,478 B2
Apparatus for and method of processing workpiece
Kazuma Sekiya, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on May 25, 2023, as Appl. No. 18/323,567.
Claims priority of application No. 2022-090487 (JP), filed on Jun. 2, 2022.
Prior Publication US 2023/0390878 A1, Dec. 7, 2023
Int. Cl. H01L 21/683 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/6835 (2013.01) [H01L 21/67092 (2013.01); H01L 21/67132 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An apparatus for processing a workpiece, comprising:
a holding table having a holding surface for holding the workpiece thereon;
a processing unit for processing the workpiece held on the holding surface of the holding table; and
a table cover for covering the holding surface when the workpiece is not held on the holding surface,
wherein the table cover has a contact surface for contacting at least the holding surface of the holding table, the contact surface being adhesive in nature.