| CPC H01L 21/67092 (2013.01) [H01L 21/67051 (2013.01); H01L 21/67259 (2013.01); H01L 21/67742 (2013.01); B32B 43/006 (2013.01); Y10T 156/1158 (2015.01); Y10T 156/1917 (2015.01)] | 10 Claims |

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1. A separating system, comprising:
a placing unit configured to place therein a first cassette allowed to accommodate a combined substrate in which a first substrate and a second substrate are bonded to each other with a separation layer therebetween, a second cassette allowed to accommodate the first substrate, and a third cassette allowed to accommodate the second substrate;
a removing apparatus configured to remove the separation layer by radiating laser light to the separation layer and allowing the separation layer to absorb the laser light, to thereby separate the first substrate and the second substrate from the combined substrate;
a transfer device configured to perform a processing of transferring the combined substrate to the removing apparatus and a processing of transferring the first substrate and the second substrate separated from the combined substrate to the placing unit;
a detector disposed above the combined substrate in the removing apparatus, and configured to detect a separating state of the combined substrate in the removing apparatus by measuring a distance to a top surface of the combined substrate; and
a controller configured to determine that the combined substrate is separated into the first substrate and the second substrate when an absolute value of a difference between the distance detected by the detector before a processing by the removing apparatus and the distance detected by the detector after the processing by the removing apparatus exceeds a threshold value.
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